In the process of semiconductor manufacturing advancing towards 3nm and below, the precision of wafer processing equipment directly determines the yield and performance of chips. As the "porters" and "positioning devices" of modern chip manufacturing, wafer transfer systems, calibrators, and handling robots constitute the three core equipment of the production line. Among them, wafer transfer systems achieve non-destructive transmission of wafers between process chambers through vacuum adsorption and multi-axis coordinated movement; wafer calibrators ensure the positional accuracy of wafers in key processes such as lithography and etching (error ≤ ±0.1mm) by using optical sensing and nanometer-level motion control; while handling robots complete the rapid grasping and placement of hundreds of wafers per hour through intelligent algorithms and high-rigidity structures. The coordinated operation of these devices has pushed semiconductor manufacturing from the "micron era" to the "nanometer era". 

I. Technological Innovation Map of Precision Equipment 

The intelligent evolution of wafer handling robots 

Modern material handling robotic arms have broken through the limitations of traditional mechanical arms, integrating deep learning algorithms and multi-modal sensors. For instance, the intelligent robotic arm developed by Prim Semiconductor can identify the edge notch of wafers in real time and dynamically adjust the grasping force (with an accuracy of ±0.05mm), while reducing downtime by 30% through a predictive maintenance module. The core of this technology lies in the "multi-axis collaborative nanometer motion control platform", which achieves a repeat positioning accuracy of 0.1μm through the combination of air-float guide rails and magnetic encoders. 

The Optical Revolution of Wafer Aligners 

Calibration technology is shifting from mechanical alignment to the integration of optics and machine vision. Prim's new generation of calibrators uses coaxial light edge measurement sensors to accurately locate the notch of a wafer within 3 seconds (with an angular error of ≤±0.1°), and supports full contour detection of transparent wafers. Its embedded controller design significantly saves equipment space, and it meets the ISO Class 2 cleanliness standard, perfectly adapting to the demanding environment of EUV lithography machines. 

Breakthrough in Lightweight Ceramic Plate Forks 

As a key component of the wafer loading system, the ceramic fork needs to have both high strength and low contamination characteristics. Prim has reduced the weight of the fork by 40% through nanoscale grinding technology, while increasing its flexural strength to 1200 MPa, effectively reducing vibration interference during the wafer transmission process. 

II. The "Hardcore" Practice of Huzhou Primus Semiconductor 

As a leading domestic enterprise in semiconductor precision equipment, Prim Semiconductor has established a full-chain technology system from air-floatation rotating shafts to complete equipment, with "nanometer-level motion control" as its core competitiveness. Its R&D base in Wuxi is equipped with a 2,000-square-meter clean laboratory and Japanese imported CNC machine tools, achieving 100% domestic production of key components. The wafer handling robot series products released in 2025 have increased production capacity to 1,200 wafers per hour through multi-axis collaborative algorithms, with a yield rate exceeding 99.98%, directly helping domestic wafer factories break through the 7nm process bottleneck. 

III. Future Trends: From Standalone Intelligence to Factory-wide Collaboration 

With the penetration of AI and Internet of Things (IoT) technologies, the next generation of precision equipment will exhibit three major trends: 

Digital twin technology: Optimize the transportation path in real-time through simulation to reduce the exposure time of wafers. 

Adaptive calibration system: Dynamically compensates for process deviations using RF probe calibration techniques (such as de-embedding algorithms). 

Modular design: The "plug and play" motion control platform proposed by Prim can quickly adapt to different process requirements. 

Conclusion

From nano-scale motion stages to intelligent handling systems, precision equipment is emerging as the "hidden champion" in semiconductor manufacturing. The innovative practices of enterprises like Huzhou Primetech have not only broken the foreign technological monopoly but also reshaped the competitive landscape of the global semiconductor industry chain with "Chinese precision".